Advanced Optical Packaging Design Tech Lead
MediaTek • San Jose, California • Posted June 07, 2026
Position Overview
Job DescriptionResponsible for defining, developing, and delivering advanced optical packaging architectures for next-generation optical engines, silicon photonics products, and co-packaged optics platforms. This is a highly visible technical leadership role with responsibility for package architecture, substrate design, hybrid bonding integration, warpage risk management, signal integrity, and production enablement.
The ideal candidate brings deep expertise in substrate and packaging technologies, hybrid bonding, thermo-mechanical behavior, and high-speed interconnect design, and works effectively across PIC, IC, systems, reliability, manufacturing, and supplier teams. This role also requires strong cross-functional execution to translate advanced packaging concepts into scalable, manufacturable product solutions.
•Define package architecture and technology direction for advanced optical and optoelectronic products, including optical engines, silicon photonics assemblies,...
The ideal candidate brings deep expertise in substrate and packaging technologies, hybrid bonding, thermo-mechanical behavior, and high-speed interconnect design, and works effectively across PIC, IC, systems, reliability, manufacturing, and supplier teams. This role also requires strong cross-functional execution to translate advanced packaging concepts into scalable, manufacturable product solutions.
•Define package architecture and technology direction for advanced optical and optoelectronic products, including optical engines, silicon photonics assemblies,...