Lead Silicon Photonics Process Engineer – Thinning & Dicing

lumilens • singapore, singapore • Posted July 15, 2026

Position Overview

lumilens is seeking a skilled process engineer in Singapore focused on the silicon photonics field. The successful candidate will be responsible for the wafer backside grinding/thinning and development processes, ensuring quality and efficiency.

Candidates will need a Bachelor's or Master's in a relevant engineering discipline, alongside at least 3 years of process engineering experience. The company offers a dynamic work environment focused on innovation and quality in advanced packaging.

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