Process Development Engineer - Die Reconstruction/Die Attach Process

Your Role

• To setup die reconstruction/die attach Process.
• To develop and to industrialize die reconstruction/die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.
• To support assembly of engineering sample for new packages or new technologies.
• To characterize die reconstruction/die attach process and materials.
• To generate and update process specifications, SOP, FMEA and process control plan.
• To provide technical support when there are critical quality concerns related to die reconstruction/die attach material / process.

Your Skills & Experiences

• More than 3 years working experience.
• Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.
• Equi...