Senior 3DIC Packaging Engineer – TSV/HB Stack

Bitdeer Technologies Group, located in Singapore, is seeking a skilled 3DIC Integration Engineer to take ownership of complex semiconductor packaging processes and ensure designs meet high-performance standards. You will work closely with various partners to manage interfaces and set design methodologies.

Your role will involve collaboration with foundries and memory partners, and you'll be responsible for bridging cross-organizational efforts. This position offers opportunities for impactful contributions to advanced semiconductor technologies, with a focus on exciting and fast-paced projects.