Senior Scientist – Hybrid Bonding & 2.5D/3D Packaging

A leading research institute in Singapore is seeking a passionate Principal Scientist to join their Heterogeneous Integration Department. This role focuses on advancing hybrid bonding processes and developing fabrication techniques for 2.5D and 3D packaging applications. The ideal candidate will have a PhD in a relevant field and experience with microelectronics. Responsibilities include collaborating on technology roadmaps, leading projects, and mentoring talents. If you have strong problem-solving skills and technical expertise in hybrid bonding, consider applying for this exciting opportunity.
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