Senior Wafer Bumping R&D Lead — Strategy & Execution

UTAC Headquarters Pte. Ltd. is seeking a seasoned technical project leader to oversee wafer bumping process development and cross-functional teams, ensuring on-time delivery within budget and readiness for pre-production.

You will coordinate with customers and suppliers, evaluate new enabling processes, train staff, and drive roadmap aligned with company goals, leveraging expertise in PVD, lithography, plating, and WLCSP backend.